Samsung signs a $200 billion chip deal with Broadcom covering memory, foundry and advanced packaging through 2030

Samsung and Broadcom signed a memorandum of understanding exceeding $200 billion for supplying AI-related memory chips, foundry manufacturing, and advanced packaging through 2030. Samsung will provide next-gen high-bandwidth memory and manufacture Broadcom's AI chips using advanced process technologies. The deal aims to strengthen supply chain resilience and expand Samsung's foundry market presence.