TSMC breaks ground on more advanced packaging fabs in Chiayi
AI Today Summary
TSMC is expanding its advanced packaging facilities at the Chiayi Science Park in southern Taiwan, adding three new fabs in Phase II to meet growing demand for high-performance computing chips, particularly for AI applications. The expansion aims to create a packaging cluster that will significantly boost annual output and employment, connecting with other regional science parks to form a comprehensive semiconductor corridor. This development coincides with TSMC's record second-quarter revenue,
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