Xiaomi’s new Xring O3 is built at TSMC, and aimed at a few hundred thousand phones

Xiaomi has introduced the Xring O3, a system-on-chip manufactured by TSMC using its 3nm process, intended for a limited run of 200,000 to 300,000 units in its upcoming flagship foldable phone. This move continues Xiaomi's strategy of developing custom chips for premium devices, following earlier models like the Xring O1, and aligns with industry trends among major smartphone makers.